(2) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Notes (1) T amb = 25 ☌, unless otherwise specified. PARAMETER COUPLER Isolation test voltage Creepage distance Clearance distance Isolation thickness between emitter and detector Comparative tracking index Isolation resistance Storage temperature Operating temperature Junction temperature Soldering temperature max.10 s dip soldering: distance to seating plane 1.5 mm DIN IEC 112/VDE 0303, part 1 VIO 500 V, Tamb 25 ☌ VIO 500 V, Tamb 100 ☌ RIO Tstg Tamb Tj Tsld VISO to ☌ VRMS mm Optocoupler, Phototransistor Output, Vishay Semiconductors with Base Connection PARAMETER INPUT Reverse voltage Forward current Surge current Power dissipation OUTPUT Collector emitter breakdown voltage Emitter base breakdown voltage Collector current Power dissipation Switch mode power supply feedback Telephone ring detection Logic ground isolation Logic coupling with high frequency noise rejection Each optocoupler consists of gallium arsenide infrared LED and a silicon NPN phototransistor. The 4N25 family is an industry standard single channel phototransistor coupler. Isolation test voltage 5000 VRMS Interfaces with common logic families Input-output coupling capacitance < 0.5 pF Industry standard dual-in-line 6 pin package Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC Optocoupler, Phototransistor Output, with Base Connection
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